Location: Nuneaton
Hours: 25 hours (1 week)
Area: Central Region
Business Area: MIRA Technology Park
This 1-week engineering work experience placement is an exciting opportunity for students who are curious about engineering and want to see how the industry works in a real professional environment.
During the placement, you will spend time within HORIBA MIRA and selected companies based at the MIRA Technology Park. You’ll be introduced to different areas of engineering and gain an understanding of how innovative ideas are developed, tested, and applied in the automotive and mobility sector.
What you can expect to gain:
- Exposure to real engineering workplaces and day-to-day professional activities
- The chance to learn from experienced engineers, consultants, and industry specialists
- Insight into advanced technologies, testing environments, and simulation tools
- Early careers advice to help you understand possible future pathways in engineering
This placement is ideal for anyone considering a future in engineering who wants to build confidence, knowledge, and motivation by learning directly from professionals in the field.
What we recommend including in your application:
- A clear interest in completing work experience with HORIBA MIRA
- Curiosity about automotive engineering and future mobility
- Examples of teamwork and collaboration
- Relevant subjects you are studying, particularly in STEM or STEAM areas
- Any examples that show problem-solving skills
- Involvement in youth groups, clubs, or organisations (if applicable)
Inclusion and Support
HORIBA MIRA is committed to equality, diversity, and inclusion. We aim to provide a welcoming and supportive environment where everyone feels respected and able to succeed. If you require any adjustments during the application or placement process, support is available upon request.
Please note that this opportunity does not meet the requirements for Skilled Worker visa sponsorship. Applicants should ensure they meet the necessary eligibility criteria before applying.
